Nanofabrication Facilities:

We are equipped with two micro-nanofabrication facilities at UCF with the following capabilities-

Lithography

Raith (Leica)EBPG 5000+

MJB4 UV Mask Aligner

MJB3 UV Mask Aligner

Mask Aligner & UV Lithography

Laser Lithography

Deposition

Plasma-therm PECVD

Denton Pro Desktop Sputterer

Temescal Ebeam Evaporator

V&N Ebeam Evaporator

Bell jar Thermal Evaporator

ALD System

6-Gun Sputtering System

2-Gun EBeam Evaporation

3-Gun Sputtering System

4-Gun Sputtering System

PECVD

Spin coater

Etching

Takachi (formerly Apex) etcher

Oxford Plasma Pro 100

III-V Unaxis Shuttleline etcher

Tabletop RIE

RIE

Material and Device Characterization in Cleanroom and MCF, UCF

AFM

Profilometer

Nikon Optical Microscope

Filmetrics

Surface Profiler

Scanning Electron Microscope

Zeiss ULTRA-55 FEG SEM (Scanning Electron Microscopy)

-Resolution 1 nm @ 15 KV, 1.7 nm @ 1 KV

JEOL JSM-6480 SEM (Scanning Electron Microscopy)

-Accelerating Voltage: 0.3 to 30 kV

3-D Surface Profiler

Thin Film Stress Measurement Tool

Focused Ion Beam

Cameca IMS-3F SIMS Ion Microscope
(Secondary Ion Mass Spectrometry)

-Primary ions: O2+, O-, Ar+, Xe+, Cs+ from 5 to 15kV

 

PHI Adept 1010 Dynamic SIMS System
(Secondary Ion Mass Spectrometry)

-Primary ions: O2+, Ar+, Xe+, Cs+ from 250eV to 8kV

Q-Lab Characterization Facilities: