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Lithography

Mask Aligner & UV Lithography

Tier 2, Room 124

Capabilities: Allows substrate sizes of 3 and 4 inches, substrates that are typically silicon, and there are 4-inch and 5-inch mask holders available. The maximum wafer thickness is 10 mm. The minimum feature size ranges from 1.0 um to 3.6 um depending on exposure mode.

Manufacturer/ Product Name: EVG 620

Laser Lithography

Tier 4, Room 163

Capabilities: Allows glass photomasks and silicon substrates are 5 inches and 4 inches in size, respectively. Utilizes a 405 nm diode laser and has three available write heads with minimum feature sizes of 0.6 um, 1 um, and 2 um. Additional features include backside alignment, vector exposure, and advanced grayscale exposure.

Manufacturer/ Product Name: Heidelberg DWL 66+

Deposition

ALD System

Tier 3, Room 124

Capabilities: Typically allows 4-inch substrates. Possible deposition materials include Titanium Oxide, Silicon Dioxide, Aluminum Oxide, Zinc Oxide, Platinum and Ruthenium.

Manufacturer/ Product Name: Anric Technologies, AT 410

6-Gun Sputtering System

Tier 3, Room 124

Capabilities: Typically allows 4-inch substrates, and 6 2-inch targets. This system is equipped with 6 DC power supplies and 1 RF power supply. Toxic materials are not allowed in this system.

Manufacturer/ Product Name: AJA International, ATC 2200-V

2-Gun EBeam Evaporation

Tier 3, Room 124

Capabilities: Typically allows 4-inch substrates. There are 2 5-pocket linear electron beam guns, with a pocket size of 7 cc (cubic centimeters). Toxic materials are not allowed in this system.

Manufacturer/ Product Name: AJA International

3-Gun Sputtering System

Tier 3, Room 124

Capabilities: Typically allows 4-inch substrates, and 3 3-inch targets. This system is equipped with a DC power supply and 2 RF power supplies. Toxic materials are not allowed in this system.

Manufacturer/ Product Name: AJA International, ATC 1800

4-Gun Sputtering System

Tier 3, Room 163

Capabilities: Typically allows 4-inch substrates, and 4 2-inch targets. This system has a DC power supply with high power impulse magnetron sputtering capabilities along with 2 RF power supplies. Toxic materials are not allowed in this system.

Manufacturer/ Product Name: AJA International

Etching

Tabletop RIE

Tier 1, Room 124

Capabilities: Typically allows 4-inch substrates, with Sulfur Hexafluoride (SF6), Dioxygen (O2), and Dinitrogen (N2) available.

Manufacturer/ Product Name: March Instruments Inc., Jupiter II

Characterization

Surface Profiler

Tier 3, Room 163

Capabilities: Stylus based surface profiler.

Manufacturer/ Product Name: Veeco, Dektak 150

Scanning Electron Microscope

Tier 4, Room 163

Manufacturer/ Product Name: Hitachi, S-4700

3-D Surface Profiler

Tier 1, Room 163

Capabilities: Has a resolution of 1 nm with laser confocal scanning, focus variation, and film thickness measurement functionalities.

Manufacturer/ Product Name: Keyence VK-X3050

Thin Film Stress Measurement Tool

Tier 2, Room 124

Capabilities: Allows substrate sizes up to 6 inches.

Manufacturer/ Product Name: Flexus F2300

Furnaces

Vacuum Annealing Furnace

Tier 3, Room 124

Capabilities: Maximum substrate size of 4 inches.

Manufacturer/ Product Name: Across International, TF 1400 Tube Furnace

Doping/Oxidation Furnaces

Tier 1, Room 163

Capabilities: Maximum substrate size of 3 inches.

Manufacturer/ Product Name: MiniBrute

Rapid Thermal Annealer

Tier 3, Room 163

Capabilities: Maximum substrate size of 4 inches.

Manufacturer/ Product Name: Jipelec, JetFirst 150