Equipment -

Lithography

Mask Aligner & UV Lithography

Tier 2, Room 124

Capabilities: Allows substrate sizes of 3 and 4 inches, substrates that are typically silicon, and there are 4-inch and 5-inch mask holders available. The maximum wafer thickness is 10 mm. The minimum feature size ranges from 1.0 um to 3.6 um depending on exposure mode.

Manufacturer/ Product Name: EVG 620

Laser Lithography

Tier 4, Room 163

Capabilities: Allows glass photomasks and silicon substrates are 5 inches and 4 inches in size, respectively. Utilizes a 405 nm diode laser and has three available write heads with minimum feature sizes of 0.6 um, 1 um, and 2 um. Additional features include backside alignment, vector exposure, and advanced grayscale exposure.

Manufacturer/ Product Name: Heidelberg DWL 66+

Deposition

ALD System

Tier 3, Room 124

Capabilities: Typically allows 4-inch substrates. Possible deposition materials include Titanium Oxide, Silicon Dioxide, Aluminum Oxide, Zinc Oxide, Platinum and Ruthenium.

Manufacturer/ Product Name: Anric Technologies, AT 410

6-Gun Sputtering System

Tier 3, Room 124

Capabilities: Typically allows 4-inch substrates, and 6 2-inch targets. This system is equipped with 6 DC power supplies and 1 RF power supply. Toxic materials are not allowed in this system.

Manufacturer/ Product Name: AJA International, ATC 2200-V

2-Gun EBeam Evaporation

Tier 3, Room 124

Capabilities: Typically allows 4-inch substrates. There are 2 5-pocket linear electron beam guns, with a pocket size of 7 cc (cubic centimeters). Toxic materials are not allowed in this system.

Manufacturer/ Product Name: AJA International

3-Gun Sputtering System

Tier 3, Room 124

Capabilities: Typically allows 4-inch substrates, and 3 3-inch targets. This system is equipped with a DC power supply and 2 RF power supplies. Toxic materials are not allowed in this system.

Manufacturer/ Product Name: AJA International, ATC 1800

4-Gun Sputtering System

Tier 3, Room 163

Capabilities: Typically allows 4-inch substrates, and 4 2-inch targets. This system has a DC power supply with high power impulse magnetron sputtering capabilities along with 2 RF power supplies. Toxic materials are not allowed in this system.

Manufacturer/ Product Name: AJA International

Etching

Tabletop RIE

Tier 1, Room 124

Capabilities: Typically allows 4-inch substrates, with Sulfur Hexafluoride (SF6), Dioxygen (O2), and Dinitrogen (N2) available.

Manufacturer/ Product Name: March Instruments Inc., Jupiter II

RIE

Tier 2, Room ENG1 – 163

Capabilities: This is a semi-automatic reactive ion etching (RIE) system designed for etching of dielectric, passivation, and semiconductor materials. It supports a wide range of etchable materials, including silicon dioxide, silicon nitride, silicon oxy-nitride, silicon, poly-Si, polyimide, photoresist, and various polymeric films. The system accommodates samples up to 6 inches in diameter. The substrate is water-cooled, and RF power operates at 13.56 MHz with a maximum output of 200W. Available process gases include CF4, O2, Ar, and SF6, making the RIE-1C versatile for various etching applications.

Manufacturer/ Product Name: SAMCO – Model: RIE-1C