Lithography
Mask Aligner & UV LithographyTier 2, Room 124 Capabilities: Allows substrate sizes of 3 and 4 inches, substrates that are typically silicon, and there are 4-inch and 5-inch mask holders available. The maximum wafer thickness is 10 mm. The minimum feature size ranges from 1.0 um to 3.6 um depending on exposure mode. Manufacturer/ Product Name: EVG 620 |
Laser LithographyTier 4, Room 163 Capabilities: Allows glass photomasks and silicon substrates are 5 inches and 4 inches in size, respectively. Utilizes a 405 nm diode laser and has three available write heads with minimum feature sizes of 0.6 um, 1 um, and 2 um. Additional features include backside alignment, vector exposure, and advanced grayscale exposure. Manufacturer/ Product Name: Heidelberg DWL 66+ |
Deposition
ALD SystemTier 3, Room 124 Capabilities: Typically allows 4-inch substrates. Possible deposition materials include Titanium Oxide, Silicon Dioxide, Aluminum Oxide, Zinc Oxide, Platinum and Ruthenium. Manufacturer/ Product Name: Anric Technologies, AT 410 |
6-Gun Sputtering SystemTier 3, Room 124 Capabilities: Typically allows 4-inch substrates, and 6 2-inch targets. This system is equipped with 6 DC power supplies and 1 RF power supply. Toxic materials are not allowed in this system. Manufacturer/ Product Name: AJA International, ATC 2200-V |
2-Gun EBeam EvaporationTier 3, Room 124 Capabilities: Typically allows 4-inch substrates. There are 2 5-pocket linear electron beam guns, with a pocket size of 7 cc (cubic centimeters). Toxic materials are not allowed in this system. Manufacturer/ Product Name: AJA International |
3-Gun Sputtering SystemTier 3, Room 124 Capabilities: Typically allows 4-inch substrates, and 3 3-inch targets. This system is equipped with a DC power supply and 2 RF power supplies. Toxic materials are not allowed in this system. Manufacturer/ Product Name: AJA International, ATC 1800 |
4-Gun Sputtering SystemTier 3, Room 163 Capabilities: Typically allows 4-inch substrates, and 4 2-inch targets. This system has a DC power supply with high power impulse magnetron sputtering capabilities along with 2 RF power supplies. Toxic materials are not allowed in this system. Manufacturer/ Product Name: AJA International |
Etching
Tabletop RIETier 1, Room 124 Capabilities: Typically allows 4-inch substrates, with Sulfur Hexafluoride (SF6), Dioxygen (O2), and Dinitrogen (N2) available. Manufacturer/ Product Name: March Instruments Inc., Jupiter II |
Characterization
Surface ProfilerTier 3, Room 163 Capabilities: Stylus based surface profiler. Manufacturer/ Product Name: Veeco, Dektak 150 |
Scanning Electron MicroscopeTier 4, Room 163 Manufacturer/ Product Name: Hitachi, S-4700 |
3-D Surface ProfilerTier 1, Room 163 Capabilities: Has a resolution of 1 nm with laser confocal scanning, focus variation, and film thickness measurement functionalities. Manufacturer/ Product Name: Keyence VK-X3050 |
Thin Film Stress Measurement ToolTier 2, Room 124 Capabilities: Allows substrate sizes up to 6 inches. Manufacturer/ Product Name: Flexus F2300 |
Furnaces
Vacuum Annealing FurnaceTier 3, Room 124 Capabilities: Maximum substrate size of 4 inches. Manufacturer/ Product Name: Across International, TF 1400 Tube Furnace |
Doping/Oxidation FurnacesTier 1, Room 163 Capabilities: Maximum substrate size of 3 inches. Manufacturer/ Product Name: MiniBrute |
Rapid Thermal AnnealerTier 3, Room 163 Capabilities: Maximum substrate size of 4 inches. Manufacturer/ Product Name: Jipelec, JetFirst 150 |