May 25, 2023
Tier 4, Room 163
Capabilities: Allows glass photomasks and silicon substrates are 5 inches and 4 inches in size, respectively. Utilizes a 405 nm diode laser and has three available write heads with minimum feature sizes of 0.6 um, 1 um, and 2 um. Additional features include backside alignment, vector exposure, and advanced grayscale exposure.
Manufacturer/ Product Name: Heidelberg DWL 66+
May 25, 2023
Tier 2, Room 124 Capabilities: Allows substrate sizes of 3 and 4 inches, substrates that are typically silicon, and there are 4-inch and 5-inch mask holders available. The maximum wafer thickness is 10 mm. The minimum feature size ranges from 1.0 um to 3.6 um depending on exposure mode. Manufacturer/ Product Name: EVG 620
April 18, 2012
Congratulations to Ph.D. student Ya Shen for receiving the best student research presentation award in 2012 IEEE Wireless and Microwave Technology Conference (WAMICON) held at Cocoa Beach, FL on April 16-17, 2012. She is co-advised by Drs. Xun Gong and Parveen Wahid.
July 12, 2011
Congratulations to Dr. Thomas Wu on his promotion to Professor, and to Drs. Xun Gong and Jun Wang on their promotions to Associate Professor.”